Novatel Wireless Announces Successful HSPA+ Dual-Carrier Data Transmission with Qualcomm's MDM8220 Chipset

First Data Call with Peak Throughput of up to 40 Mbps Completed

SAN DIEGO, January 2010 – Novatel Wireless, a leading provider of wireless broadband solutions, today announced that it has successfully completed the first data transmission over dual-carrier HSPA+ using Qualcomm's industry-leading MDM8220 chipset. Dual-carrier HSPA+ is a network innovation that will deliver more advanced data capabilities and support more compelling applications with richer user experiences. Novatel Wireless is working with operators and plans to launch commercial data devices based on the MDM8220 in the second half of 2010.

"Novatel Wireless is continuously investing in research and development to ensure that we lead the market with cutting edge wireless data solutions," said Dr. Slim Souissi, CTO, Novatel Wireless. "We are very pleased to be working closely with industry technology leader Qualcomm to achieve these technical milestones, and we look forward to continuing to evolve our product line to deliver innovative solutions to meet the needs of our customers."

Novatel Wireless, Inc. is a leader in the design and development of innovative wireless broadband access solutions based on 3G and 4G technologies. Novatel Wireless' Intelligent Mobile Hotspot products, software, USB modems and embedded modules enable high-speed wireless Internet access on leading wireless data networks. The Company delivers specialized wireless solutions to carriers, distributors, OEMs and vertical markets worldwide.

SOURCE: Novatel Wireless